Let’s discuss about terminal blocks in EtherCAT high-speed I/O modules, exploring their importance in industrial automation, comparing next-gen ultra-thin terminals with legacy models, summarizing key procurement criteria, and predicting future trends toward intelligence and high-density integration.
Designed for industrial engineers, system integrators, and procurement decision-makers.
Part 1: The Importance of Terminal Blocks in EtherCAT High-Speed I/O Modules
EtherCAT, known for microsecond-level real-time performance and high bandwidth, is widely used in smart manufacturing and robotics. As the “last centimeter” of signal transmission, terminal blocks directly impact system reliability:
1.1 Mechanical Stability and Durability
In harsh industrial environments such as vibration, high temperatures, and humidity, the mechanical design of terminal blocks determines the system’s service life:
Anti-Vibration Design: Spring-type terminals (e.g., screwless XD series) offer 50% better vibration resistance than traditional screw terminals, making them suitable for dynamic applications like AGVs and robots.
Corrosion Resistance: Terminals using flame-retardant PA66 housings or gold-plated contacts resist salt spray and chemical corrosion, extending lifespan.
IP Protection: IP67-rated terminals prevent dust and moisture ingress, ideal for outdoor or high-humidity applications.
1.2 Space Optimization and Maintenance Efficiency
With the trend toward device miniaturization, terminals must balance high-density layouts with ease of maintenance:
Ultra-Slim Design: Next-generation terminals can reduce thickness to 7.7 mm (compared to 8.5 mm for older versions), saving space and suiting compact I/O modules (e.g., ZLG’s 16-channel modules).
Hot-Swappable Capability: Modular terminals (e.g., plug-in types by Emar Smart) allow replacements without power shutdown, cutting downtime by up to 70%.
1.3 Long-Term Stability and Cost Control
Maintenance-Free Design: Traditional screw terminals are prone to rust and poor contact. In contrast, spring terminals feature tool-free installation and self-locking mechanisms, reducing maintenance frequency.
Wide Temperature Adaptability: Designs rated from -40°C to +125°C ensure stable operation in extreme environments, lowering failure rates.
Part 2: Legacy vs. Next-Gen Ultra-Thin Terminal Blocks: Why Upgrade?
In industrial applications, especially within compact EtherCAT I/O modules, the demand for space-saving, high-efficiency connection components has led to the development of ultra-slim terminal blocks. The newly upgraded ultra-slim terminal offers significant advantages over traditional models in the following aspects:
1) Core Product Advantages (Based on FS1.5-XX-500-12)
The AOSI FS1.5-XX-500-12 ultra-thin terminal block, which we are now promoting, represents a revolutionary breakthrough for EtherCAT high-speed I/O module applications:
1.1 Extreme Space Optimization
Industry-leading thinness: At just 7.7mm in thickness (compared to traditional terminals typically ≥8mm), it is one of the thinnest SMD terminals on the market, saving over 60% vertical space.
Unique design: The unique structure supports mixed wire gauges of 1.5mm² and 2.5mm², enabling high-density PCB layouts (e.g., reducing the size of a 32-channel DI module by 40%).
1.2 Military-Grade Reliability
Vibration resistance: Complies with IEC 60068-2-6 standards (5-500Hz/15G random vibration), offering 3x better shock resistance than traditional terminals. Gold-plated contact system: Contact resistance <2mΩ (industry average: 5mΩ), ensuring zero signal distortion for EtherCAT 100Mbps transmission. Wide temperature range (-40°C to +105°C): Uses specialized PPS material, maintaining insulation resistance >100MΩ even at high temperatures.2)Technical Comparison: Legacy vs. New Terminals
| Key Metric | Legacy Terminals | SPT SMD 1.5/2-H-3.5 R24 | Upgrade Benefit |
|---|---|---|---|
| Mounting thinnest | 10mm | 7.7mm | 60% space savings |
| Vibration Resistance | 5G (IEC 60068-2-6) | 15G | Enhanced suitability for industrial robots |
| Installation Method | Manual soldering | Fully automated SMT mounting | 80% higher production efficiency |
3)Key Benefits of Our Ultra-Thin Terminals
- Space Savings — Ideal for high-density EtherCAT I/O modules.
- Superior Signal Integrity — Gold-plated contacts ensure <2mΩ resistance.
- Industrial Durability — Withstands -40°C to +105°C.
- Smart Manufacturing Ready – Compatible with SMT assembly, reducing production costs.
4) Try Before You Buy — Free Samples Available!
We understand that reliability is non-negotiable in industrial automation. That’s why we offer:
- Free Samples — Test our ultra-thin terminals risk-free.
- Technical Support — 1-on-1 guidance for seamless integration.
- Lifetime After-Sales Service – From installation to troubleshooting, we’ve got you covered.
- Contact us todayto request your free sample or discuss customization options!
Part 3: Industry Future Trends: Intelligent and High-Density Integration
With the rapid development of Industry 4.0, the Internet of Things (IoT), and artificial intelligence (AI), terminal block technology is evolving toward intelligence and high-density integration:
1. Intelligence: From Passive Connection to Active Sensing
Future terminal blocks will no longer be simple electrical connectors but smart components capable of data acquisition, status monitoring, and self-diagnosis:
Embedded Sensor Technology
Integrated temperature, current, and vibration sensors for real-time monitoring of connection status (e.g., contact resistance changes, loosening warnings).
Example: Phoenix Contact’s Smart Terminal Block can upload data to the cloud via IO-Link for predictive maintenance.
2. High-Density Integration: Smaller, Faster, Stronger
To meet the demands of device miniaturization and high performance, terminal technology will break traditional space constraints:
Stacking and Miniaturization
IMulti-layer stacked terminals support 2-3x more channels in the same footprint.
Ultra-thin designs (<2mm thickness) cater to emerging needs like wearable devices and micro-robots.
3. Green Manufacturing and Sustainability
Environmental regulations (e.g., EU RoHS 3.0) are driving terminal technology toward low-carbon solutions:
Bio-Based Materials
Use of PA410 bioplastics reduces carbon footprint by 40% while maintaining flame resistance (UL94 V-0).
Halogen-Free Designs
Replaces traditional PVC materials, complying with IEC 61249-2-21 standards.
Modular Recycling
Quick-disassembly designs improve copper/plastic recovery rates to over 95%.
Conculsion:
As EtherCAT high-speed I/O modules evolve towards miniaturization and intelligence, ultra-thin terminal blocks have become a key part of improving system performance. Choosing a terminal solution that combines anti-interference, space efficiency and scalability will be an important bargaining chip for companies to win the competition in Industry 4.0.
